Effect of Cu Addition on Properties of Sn-Ag Lead Free Solder.
نویسندگان
چکیده
منابع مشابه
Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...
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The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) CueSn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic...
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The effect of Au addition on the microstructural and the tensile properties of Sn–0.7 mass%Cu alloy was examined. Tensile strength and 0.2% proof stress remarkably increase up to 0.3 mass%Au primarily due to solid solution hardening. Beyond 0.3 mass%Au, due to precipitation of large intermetallic compounds, elongation decreases while tensile strength and 0.2% proof stress increase slightly. Wit...
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The effect of Al on the corrosion resistance behaviour of Pb-free Sn–1.0Ag–0.5Cu–xAl solder (x 1⁄4 0.2 wt%, 0.5 wt% and 1.0 wt%) in 5% NaCl solution was investigated by using potentiodynamic polarization and salt spray exposure. Passivation behaviour was evident in all the solder formulations containing Al, compared to the base SAC solder. FESEM and XRD results revealed that more dense passive ...
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-In this study bulk and thin cast samples were produced with an identical Sn3.9Ag0.6Cu composition. The thin cast material exhibited a much finer as-quenched microstructure than the bulk material with the IMC phase restricted to a thin network. Both the bulk and thin cast materials continually softened during room temperature aging, while both materials initially softened and then subsequently ...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2000
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.3.132